Metal Bond Diamond Blades
High Performance Metal Bond Ultra Thin Diamond Cutting Circular Blade for Sapphire and Monocrystalline Silicon
Metal bond diamond blades, the sintered diamond blades with the addition of metal powder in bond, have high retaining force for grain.
With the higher wear-resistance and advanced cutting capability and higher stiffness, the metal bond blades can effectively reduce cutting defects like slanted-kerf.
Mainly used for cutting sapphire, single crystal silicon, quartz, semiconductor materials, chip, PCB, silicon carbide and carbon fiber
1. High-Precision,large depth and narrow kerf
2. Smooth&fast cutting without chipping
3. Long life span and stable performance
4. Competitive price and superior quality
5. Safe package and fast delivery
6. Professional & excellent service
0.10-2.00mm (Based on diamond grit size)
According to customers’ requirement Email: email@example.com
※Resin bond & metal bond & electroplated
Welcome to wholesale the high performance metal bond ultra thin diamond cutting circular blade for sapphire and monocrystalline silicon on sale from PRC. We are a professional supplier in China, offering the customized service. All of our products are made under strict quality control and management system. Please rest assured to buy.